GENEVA, July 1 -- NITTO DENKO CORPORATION filed a patent application (JP2025/042763) for “RESIN FOAM AND FOAM MEMBER”. With publication no. WO/2026/126973, here are the other details related to the pa... Read More
GENEVA, July 1 -- SUMITOMO HEAVY INDUSTRIES, LTD. filed a patent application (JP2025/042765) for “BEAM ADJUSTMENT MECHANISM”. With publication no. WO/2026/126974, here are the other details related to... Read More
GENEVA, July 1 -- RESONAC CORPORATION filed a patent application (JP2025/042736) for “PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/12696... Read More
GENEVA, July 1 -- DAI NIPPON PRINTING CO., LTD. filed a patent application (JP2025/042743) for “PACKAGING MATERIAL, PACKAGING BAG, VACUUM PACK, METHOD FOR PRESERVING RAW FISH, AND METHOD FOR INSPECTIN... Read More
GENEVA, July 1 -- NIPPON ELECTRIC GLASS CO., LTD. filed a patent application (JP2025/042744) for “METHOD FOR MANUFACTURING LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE, LOW TEMPERATURE CO-FIRED CERAMIC ... Read More
GENEVA, July 1 -- MITSUBISHI KAKOKI KAISHA, LTD. filed a patent application (JP2025/042754) for “DEVICE FOR OPTIMIZING CONDENSATE DISCHARGE TIMING OF VERTICAL CENTRIFUGAL SEPARATOR”. With publication ... Read More
GENEVA, July 1 -- MITSUBISHI PENCIL COMPANY, LIMITED filed a patent application (JP2025/042724) for “WATER-BASED INK COMPOSITION FOR WRITING INSTRUMENTS AND WRITING INSTRUMENT”. With publication no. W... Read More
GENEVA, July 1 -- NIPPON STEEL CORPORATION filed a patent application (JP2025/042725) for “TITANIUM PLATE, TITANIUM RING, AND COPPER FOIL PRODUCTION DRUM”. With publication no. WO/2026/126965, here ar... Read More
GENEVA, July 1 -- MITSUBISHI KAKOKI KAISHA, LTD. filed a patent application (JP2025/042710) for “VERTICAL CENTRIFUGAL SEPARATOR, METHOD FOR OPERATING VERTICAL CENTRIFUGAL SEPARATOR, AND CONCENTRATED L... Read More
GENEVA, July 1 -- RESONAC CORPORATION filed a patent application (JP2025/042712) for “CURABLE RESIN MATERIAL, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE”... Read More